Leaked arena test results show Google's Gemini 4 Pro beating Anthropic's Claude Opus 5.5 in 3D physics simulations, dynamic ...

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design ...

After years of dedicated research and over 5 million supercomputer computing hours, a team has created the world's first high-resolution 3D radiation hydrodynamics simulations for exotic supernovae.

COMSOL will release Multiphysics version 2027 this fall, introducing COMSOL Systems, an add-on product for creating ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

<p>We are proud to announce the release of <a href=https://www.mataliphysics.com rel="noopener noreferrer" target=_blank>Matali Physics 6.0</a>, the sixth major ...

AMCM has integrated its EOSPRINT software with PanX to bring physics-based simulation directly into build preparation for ...

How modeling material behavior and simulating additive manufacturing processes can help engineers ensure success with 3D printing. Any engineer worth their salt understands the value of simulation.

Breaking down strategies for optimizing additive manufacturing with simulation. finite element von mises stress analysis of a mechanical part- 3d ilustration The effective use of engineering ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...