A new technical paper titled “FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates” was published by researchers at ETH Zurich. “Chiplet ...
Multi-die design teams should adopt modular principles, utilize proven IP blocks with D2D support, and implement automated ...
SAN RAMON, CALIFORNIA, USA, July 25, 2023/ EINPresswire.com / -- YorChip, Inc. today launched its patent pending UniPHY™️ dual-use PHY which enables developers to support both traditional Chiplet ...
Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and ...
While the Silicon 100 report was being compiled and curated to profile the most promising startups in the semiconductor industry in 2025, two prominent chiplet upstarts were already taken. First, ...
Substrate-based packaging for chiplet designs is gaining favor among AI HPC customers, according to sources at OSATs. Save my User ID and Password Some subscribers prefer to save their log-in ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
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