Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...

Chemical mechanical polishing (CMP) is a process of global planarization that leverages the synergetic effect of chemical reactions and mechanical abrasion to facilitate wafer polishing. CMP has ...

NuTool Inc. today introduced a copper chemical mechanical planarization (CMP) process using fixed abrasive for copper polish on Ultra Low-k dielectrics. The polishing process, which demonstrated a ...

Chemical mechanical polishing (CMP) of silicon carbide (SiC) is an essential process in the fabrication of high-performance semiconductor devices. SiC is prized for its exceptional hardness, thermal ...

Applied Materials Inc. today announced Reflexion LK, what it said is the industry's only low down force chemical mechanical polishing (CMP) system that planarizes low k and ultra-low k dielectric ...