Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The most advanced makers of semiconductor packages use plasma to improve yield and reliability, especially when using advanced materials and package sizes decrease. Chip manufacturers rely on plasma ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Quick Read Taiwan Semiconductor Manufacturing (TSM) controls advanced packaging capacity that determines which AI chipmakers can scale production. Google reportedly cut its 2026 TPU production target ...