Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, ...

As NAND flash and high-bandwidth memory (HBM) stacking technologies continue to advance, coupled with the prospective development of 3D DRAM, the semiconductor industry is abuzz with the rising ...

SAN JOSE, Calif.--(BUSINESS WIRE)-- Xperi Holding Corporation™ (NASDAQ: XPER) (“Xperi”) today announced that the company entered into a license agreement with Yangtze Memory Technologies Co., Ltd.

BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset APs and AiP ...

Samsung plans to adopt hybrid bonding technology for its HBM4 to reduce thermals and enable an ultra-wide memory interface, the company revealed at the AI Semiconductor Forum held in Seoul, South ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia, the newly launched brand for the IP Licensing business of Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”), today announced that Xperi Corporation entered ...

Groundbreaking Architectural Innovations in Scaling and Wafer Bonding Technology Deliver a Major Leap in Performance, Density and Cost Effectiveness TOKYO & SAN JOSE, Calif.--(BUSINESS ...

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...