Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...
Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...
The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...
As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...
Today’s complex SoCs are prone to thermal issues that can cause field failures. Here’s how thermal analysis can help you ferret out those hotspots. As the semiconductor industry traverses through the ...
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