With performance three times better than copper’s, this new material could substantially improve heat management of ...

Our technology loses a lot of energy as heat. For computing technology, the heat isn’t only a problem because the energy is ...

A new metallic compound has shattered a long standing barrier in heat management, conducting thermal energy nearly three times faster than the best conventional metals. The material, a special form of ...

The demand for cost-effective but increasingly greater computing power over the last fifty years has driven research and development into new materials and processes to meet the demand. Devices have ...

A research team from Skoltech (part of the VEB.RF group) and other scientific organizations in Russia and India has conducted ...

Researchers at Tsinghua University, Southern University of Science and Technology and Eastern Institute of Technology have ...

University of Houston researchers have made a groundbreaking discovery in thermal conductivity, overturning an existing theory that boron arsenide (BAs) couldn’t compete with the heat conduction of a ...

Managing heat is a major challenge in electronics and engineering, and it’s controlled using materials that either conduct or insulate heat. A new material blurs that line by blocking heat in one ...