In an exclusive interview with DIGITIMES ASIA, the Czech-based electron microscope manufacturer Tescan Group detailed a significant strategic transformation. This profound shift aims to address the ...

SK Hynix will invest 19 trillion won in a new advanced chip packaging facility in Cheongju to boost capacity for AI-driven ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...

NEW YORK, Dec. 2, 2024 /PRNewswire/ -- Report on how AI is redefining market landscape - The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

(Jan 13): SK Hynix Inc plans to spend 19 trillion won (US$12.9 billion, or $16.58 billion) building a new advanced chip ...