EP30P, a transparent, low viscosity epoxy system has a service temperature range of -60 to 250 F, resists water, acids, bases, and salts, and can be used to bond, seal, coat, and encapsulate. EP30P, a ...

The EP30LV is a two-component, room temperature curing epoxy for bonding, coating, sealing and casting. It is optically clear and has low viscosity. The formulation is 100% reactive and does not ...

Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

A low-viscosity, two-component, transparent epoxy system, called EP30P, is well-suited for high-performance bonding, sealing, coating, encapsulation, and casting. The system has a 4-to-1 mix ratio by ...

Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, ...

Master Bond EP30P is a new two component, transparent, low viscosity epoxy system for high performance bonding, sealing, coating, encapsulation and casting. This system has a 4 to 1 mix ratio by ...

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for under fill, coating, impregnating, and porosity sealing ...

EP21FL is a toughened, low-to-moderate viscosity, two-part epoxy. EP21FL two-part epoxy resin works between -60 and 250ºF and resists thermal cycling and shock. Typical viscosity at 25°C is 4,000 cps ...