A new technical paper titled “In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density” was published by researchers at National Yang Ming Chiao Tung ...
Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...
Nobody wants chips to fail in the field, but at 65 nanometers and below, sudden failure becomes a real threat. Among the most likely causes is electromigration, a problem that's affected ICs since the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback