Abstract: This study presents an innovative approach to early detection of wire bond lift-off failures in power semiconductor modules (PSMs) using an integrated on-chip temperature sensor. Despite ...
Could you please describe the main characteristics of your new sensor and give a general description of the production ...
Abstract: Soft sensor techniques have been applied to predict the hard-to-measure quality variables based on the easy-to-measure process variables in industry scenarios. Since the products are usually ...
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