Navitas’ SiCPAK power modules claim a 5× lower thermal resistance shift after 1,000 cycles of thermal shock testing.

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

Green Watt Power’s Diamond Series of 2.4-kW AC chargers target e-mobility applications with 36-120-V Li-ion batteries.

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and ...

Allegro’s CT4022/32 TMR current sensors claim ultra-low noise and high-precision current measurements for clean energy ...

Bourns’ BVRA1210 and BVRA1812 multilayer varistors with advanced transient energy absorption deliver high surge protection.

GigaDevice’s GD5F1GM9 series addresses SPI NAND Flash’s inherently slow response times and vulnerability to bad block interference.