Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) …

Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had changed, in 1977, …

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。

福利厚生 採用情報 東京本社採用 広島事業所採用 長野事業所採用 求人を探す 求める人材 採用メッセージ 社員の声 年収分布図 よくある質問 DISCO RECRUIT DISCO PR コーポレートサイト …

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer. In …

“Advanced Kiru, Kezuru and Migaku technologies” is DISCO’s business domain. In other words, DISCO will never deviate from the three technology fields of Kiru (cutting), Kezuru (grinding), and Migaku …

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as materials to …

Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of …

DGP8762 グラインダポリッシャ フルオートマチック Φ300 mmウェーハ対応 3軸4チャックテーブル